Design Of 3d Integrated Circuits And Systems

Design of 3D Integrated Circuits and Systems PDF
Author: Rohit Sharma
Publisher: CRC Press
ISBN: 1351831593
Size: 18.67 MB
Format: PDF, ePub
Category : Technology & Engineering
Languages : en
Pages : 324
View: 7366

Get Book

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Physical Design For 3d Integrated Circuits

Physical Design for 3D Integrated Circuits PDF
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Size: 66.51 MB
Format: PDF
Category : Technology & Engineering
Languages : en
Pages : 397
View: 3685

Get Book

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Electrical Modeling And Design For 3d System Integration

Electrical Modeling and Design for 3D System Integration PDF
Author: Er-Ping Li
Publisher: John Wiley & Sons
ISBN: 1118166752
Size: 72.39 MB
Format: PDF, ePub, Docs
Category : Technology & Engineering
Languages : en
Pages : 384
View: 5868

Get Book

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Three Dimensional Integrated Circuit Design

Three dimensional Integrated Circuit Design PDF
Author: Vasilis F. Pavlidis
Publisher: Morgan Kaufmann
ISBN: 9780080921860
Size: 36.41 MB
Format: PDF, ePub
Category : Technology & Engineering
Languages : en
Pages : 336
View: 4199

Get Book

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. * Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers * The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find * Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D * Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

Advances In 3d Integrated Circuits And Systems

Advances In 3d Integrated Circuits And Systems PDF
Author: Yu Hao
Publisher: World Scientific
ISBN: 9814699039
Size: 42.22 MB
Format: PDF, Docs
Category : Technology & Engineering
Languages : en
Pages : 392
View: 1299

Get Book

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation

Integrated Circuit and System Design  Power and Timing Modeling  Optimization and Simulation PDF
Author: Jose L. Ayala
Publisher: Springer Science & Business Media
ISBN: 3642241530
Size: 70.61 MB
Format: PDF, Kindle
Category : Computers
Languages : en
Pages : 352
View: 4760

Get Book

This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.

3d Integration In Vlsi Circuits

3D Integration in VLSI Circuits PDF
Author: Katsuyuki Sakuma
Publisher: CRC Press
ISBN: 1351779826
Size: 70.69 MB
Format: PDF, Kindle
Category : Technology & Engineering
Languages : en
Pages : 217
View: 897

Get Book

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Nanosystems Design And Technology

Nanosystems Design and Technology PDF
Author: Giovanni DeMicheli
Publisher: Springer Science & Business Media
ISBN: 9781441902559
Size: 69.58 MB
Format: PDF, ePub, Docs
Category : Technology & Engineering
Languages : en
Pages : 177
View: 3415

Get Book

Nanosystems use new, nanoscopic electrical and/or mechanical devices which, as constituents of electronic and electromechanical systems, find application primarily in computing, embedded control and biomedical data acquisition. In particular, this book will deal with the characterization and patterning of these materials from an engineering perspective, with the objective of creating operational prototypes and products. The book will integrate various nano technologies on materials, devices and systems and identify key areas and results. The book will describe different design aspects for integrated systems on silicon, as well as on heterogeneous platforms including, but not limited to, electrical, optical, micromechanical and biological components in various forms and mixtures. By associating research topics from differing horizons, the book will provide a unique opportunity to bridge the gap between electronics/electrical engineering and materials science. The book will include topics at the intersection of these disciplines, and will interface with computer science, biology and medicine.

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design PDF
Author: Yuan Xie
Publisher: Springer Science & Business Media
ISBN: 9781441907844
Size: 13.16 MB
Format: PDF, Mobi
Category : Technology & Engineering
Languages : en
Pages : 284
View: 4959

Get Book

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Arbitrary Modeling Of Tsvs For 3d Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits PDF
Author: Khaled Salah
Publisher: Springer
ISBN: 3319076116
Size: 72.32 MB
Format: PDF, Docs
Category : Technology & Engineering
Languages : en
Pages : 179
View: 2354

Get Book

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.